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Product Specification
Multilayer Chip Varistor
ITEM
ICVL0518030FR
ICT一级代理商: 福贝特国际（香港）有限公司
Tel: 0755‐25681756
QQ: 94070229 E‐mail: sales@fbetter.com Web: www.fbetter.com
SCOPE
☆ This specification applies to chip varistors for use in electric equipment.
It can be possible to change the specification under document agreement between design engineers of each party.
FEATURES
☆ The ICT chip varistors provide excellent application reliability as a result of their Ag base terminal electrodes with NI-Sn electroplating
CONFIGURATION and DIMENSIONS CODE L 05 10 21 31 1.0 ±0.05 1.6 ±0.1 2.0 ±0.1 3.2 ±0.15 DIMENSION (mm) W 0.5 ±0.05 0.8 ±0.1 1.25 ±0.1 1.6 ±0.15 T 0.5±0.05 0.8 ±0.1 1.35 MAX 1.45 MAX L1 0.2 +0.15/-0.1 0.3 ± 0.2 0.5 +0.2/-0.3 0.5 +0.2/-0.3 PART NUMBER CODE ICVS 05 18 030 F R ① ② ③ * ④ ⑤ *Capacitance: 101→10 ×101 pF →100pF 030→ 3 ×100 pF→ 3pF ① SERIES NAME CODE PRODUCT NAME ② SIZE DESIGNATOR CODE 05 SIZE(mm) 1.0 × 0.5 1.6 × 0.8 2.0 × 1.25 3.2 × 1.6 ICVN ICVS Normal type chip varistor Special Capacitance type chip varistor 10 21 31 ③ WORKING VOLTAGE CODE 03 05 09 12 14 VOLTAGE(VDC) 3.3 5.6 9.0 12.0 14.0 CODE 18 26 30 48 60 VOLTAGE(VDC) 18.0 26.0 ④ TERMINATION TYPECODE S P F (Pb-free) 30.0 48.0 60.0 TYPE Solderable (Ag/Pd/Pt) Electroplate (Sn/Pb) Electroplate (Ni-Sn)⑤¨ PACKAGING TYPECODE B R E TYPE Bulk pack Tape & Reel pack Embossed tape pack
NOMINAL SPECIFICATIONS ■ Special Capacitance TYPE (ICVS)
· Smallest TVS Component.
· Standard EIA Chip Sizes.
· Chip Placement Compatible
· Fastest Response Time to ESD Strikes
· Low capacitance is required for high-speed data transmission.
· Low leakage current(IL) is necessary for battery operated equipment
· ESD Protection for RF Amplifiers
ICT Leakage Varistor Peak Capacitance Part Number Current Voltage Current
Symbol ILVbIpeakC
Chip
Size Amp Volts Amp PF
Units
(Maximum) (Maximum) (max.) (max.)
Test 0.5Vrms
8/20μs 18V 1mA DC
Condition @1MHz 1005 ICVS0518030 <10μA 100~160 1 <3
* Response time <1 ns
* Varistor Voltage temperature coefficient <0.05 %/℃
* Insulation resistance after reflow soldering on PCB >10 MΩ
■ TERMINOLOGY
·Vwm : Maximum steady state DC operating voltage the varistor can maintain and not
exceed 10µA leakage current. ·VB : Voltage across the device measured at 1mA DC current ·VC : Maximum peak voltage across the varistor measured at a specified pulse and waveform ·C : Device capacitance measured with zero volt bias 0.5Vrms and 1MHz
PERFORMANCE
ITEM
REQUIREMENTS
TEST CONDITION
Operating temperature
range Storage temp. & humidity range
-55℃ ∼ +125℃ ―
40℃ max , 70% RH max. At packing condition
1. No damage such as cracks should
Resistance to solder heat
be caused in chip element.
2. More then 75% of the terminal electrode shall be covered with new solder
Preheat
temperature : 100 to 150℃ preheat time : 1 min. Solder
temperature : 260 ±10℃ dipping time : 10± 0.5sec Preheat
temperature : 100 to 150℃ preheat time : 1 min. Solder
temperature : 260 ±10℃ dipping time : 3± 1sec.
Solderability
1. More than 90% of the terminal shall be covered with new solder.
1. More then 50% of the terminal electrode shall be covered with new solder.
Reflow soldering
2. Varistor voltage change : ±within 10%
Preheat
temperature : 150℃ preheat time : 1 min. Solder
temperature : 260℃ soldering time : 10 sec.max (Reflow soldering profile)
Tensile strength (terminal strength)
Adhesion of terminal electrode (Flexure strength)
a
b c W
W
1. No mechanical damage
0.5 kg
1. No mechanical damage
0.5 0.5 0.6 1.0
ITEM REQUIREMENTS TEST CONDITION
Drop 10 times on a concrete floor from a height of 91cm Frequency : 10∼55∼10Hz
Drop 1. No mechanical damage
Vibration 1. No mechanical damage
Amplitude : 1.52 mm Direction and time
X,Y,X directions for 2 hours Step 1. -40±3℃ 30±3min. Step 2. 85±3℃ 30±3min. Number of cycle : 100 times
Thermal shock
(Temperature cycle)
1. No mechanical damage
2. Varistor voltage change : ±within 10%
Temperature : 85±2℃
Heat load resistance
1. No mechanical damage
2. Varistor voltage change : ±within 10%
Applied Voltage : working voltage Time : 1,000 hours
Measured at room ambient temperature after placing for 24 hours
Temperature : -40±5℃
Low temp. resistance
1. No mechanical damage
2. Varistor voltage change : ±within 10%
Time : 1,000 hours
Measured at room ambient temperature after placing for 24 hours
Temperature : 40±2℃
Humidity resistance
1. No mechanical damage
2. Varistor voltage change :±within 10%
Humidity : 90∼95%RH
Time : 500 hours
Measured at room ambient temperature after placing for 24 hours
Temperature : 40±2℃ Humidity : 90∼95%RH
Humidity load
resistance
1. No mechanical damage
2. Varistor voltage change :±within 10%
Applied voltage :Working Voltage Time : 500 hours Measured at room ambient temperature after placing for 24 hours
ITEM REQUIREMENTS TEST CONDITION
Temperature : 25±5℃
1. Varistor voltage change : ±within 10%
Maximum surge
current
IEC61000-4-5 standard
1.2/50㎲ - 8/20㎲ voltage-current combination pulse
Humidity : 30∼65% RH Polarity : + , -
Number of hit : each 1 time Surge pulse : 8/20㎲ pulse
Applied current : maximum
surge current(Is)
Temperature : 25±5℃
1. Varistor voltage change : ±within 10%
Maximum surge energy
IEC61000-4-5 standard 10/1000㎲ current pulse
Humidity : 30∼65% RH Number of hit : 1 time Surge pulse : 10/1000㎲ pulse Applied current : maximum
surge energy(Ws)
1. No mechanical damage
ESD life
2. Varistor voltage change : ±within 15% ESD gun (IEC61000-4-2 standard) C=150pF R=330Ω
Discharge : contact discharge
Voltage : 8,000V(level 4) Polarity : + , -
Number : 10 times, interval 1 sec.
1. No mechanical damage
ESD test
2. Varistor voltage change : ±within 15% ESD gun (IEC61000-4-2 standard) C=150pF R=330Ω
Discharge : Air discharge
Voltage : 15,000V(level 4) Polarity : + , -
Number : 10 times, interval 1 sec
LAND PATTERN & REFLOW SOLDERING ■ Land Pattern ca Size a bab c 1005 0.4~0.6 0.4~0.5 0.4~0.6 ■ Reflow Soldering Profile 10s Natural cooling 260℃ max ℃Temp.() 200℃ min 50s max Solder area Priheating : 110±20s max 165 to 185℃ Time(s)
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