NCP699
150 mA CMOS Low Iq LDOwith Enable in TSOP−5
The NCP699 series of fixed output LDO’s are designed forhandheld communication equipment and portable battery poweredapplications which require low quiescent. The NCP699 series featuresa very low ground current of 40 mA, independent of load current. Eachdevice contains a voltage reference unit, an error amplifier, a PMOSpower transistor, internal resistors for setting output voltage, currentlimit, and temperature limit protection circuits.
The NCP699 has been designed to be used with low cost capacitors.The device is housed in the micro−miniature TSOP−5 surface mountpackage. Standard voltage versions are 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, and5.0 V. Other voltages are available in 100 mV steps.
Features
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MARKINGDIAGRAMTSOP−5(SOT23−5, SC59−5)SN SUFFIXCASE 4835xxx AYWGG151•••••••••••••
Enable Control (Active High, Supports Sub 1−Volt Logic)Very Low Ground Current of 40 mA Typical
Low Dropout Voltage of 340 mV at 150 mA, and 3.0 V VoutMultiple Fixed Output Voltage OptionOutput Voltage Accuracy of 2.0%
Operating Temperature Range of −40°C to 85°CStable with 1 mF Ceramic or Tantalum CapacitorsThese are Pb−Free DevicesCellular Phones
Battery Powered Consumer ProductsHand−Held InstrumentsCamcorders and CamerasPrinters and Office Equipment
xxxAYWG= Specific Device Code= Assembly Location= Year= Work Week= Pb−Free Package(Note: Microdot may be in either location)PIN CONNECTIONSVinGndEnable123(Top View)4N/C5VoutTypical Applications
ORDERING INFORMATION
Battery orUnregulatedVoltage
Vout+See detailed ordering and shipping information in the packagedimensions section on page 8 of this data sheet.
Cin1 mF+1235Cout1 mFONOFF
4This device contains 86 active transistors
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 20071
March, 2007 − Rev. 1
Publication Order Number:
NCP699/D
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NCP699
PIN FUNCTION DESCRIPTION
Pin No.12345
Pin Name
Vin
Description
Positive power supply input voltage.Power supply ground.
Gnd
EnableN/C
This input is used to place the device into low−power standby. When this input is pulled low, the device is
disabled. If this function is not used, Enable should be connected to Vin.No internal connection.
VoutRegulated output voltage.
MAXIMUM RATINGS
Rating
Input VoltageEnable VoltageOutput VoltagePower Dissipation
Operating Junction TemperatureOperating Ambient TemperatureStorage Temperature
SymbolVinEnableVoutPDTJTATstg
Value2.1 to 6.0−0.3 to Vin +0.3−0.3 to Vin +0.3Internally Limited−40 to +125−40 to +85−55 to +150
UnitVVVW°C°C°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.
1.This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MIL−STD−883, Method 3015Machine Model Method 200 V
2.Latch−up capability (85°C) \"200 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating
Junction−to−AmbientPSIJ−Lead 2NOTE:
SymbolRqJA
Test Conditions
1 oz Copper Thickness, 100 mm21 oz Copper Thickness, 100 mm2
Typical Value
25068
Unit°C/W°C/W
Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the followingboundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.
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NCP699
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C,
unless otherwise noted.)
Characteristic
Output Voltage (Iout = 10 mA, TA = −40°C to 85°C)1.5 V1.8 V2.5 V2.8 V3.0 V3.3 V5.0 V
Line Regulation (Iout = 10 mA)
1.5 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V)4.5 V−5.0 V (Vin = 5.5 V to 6.0 V)
Load Regulation (Iout = 1.0 mA to 150 mA)Output Current Limit
1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V)4.0 V−5.0 V (Vin = 6.0 V)
Dropout Voltage (Iout = 150 mA,
Measured at Vout = Vout(nom) −3.0%)1.5 V1.8 V2.5 V2.8 V3.0 V3.3 V5.0 V
Disable Current (TA = −40°C to 85°C)(Enable Input = 0 V)
Ground Current (TA = −40°C to 85°C)
(Enable Input = Vin, Iout = 1.0 mA to Io(nom.))Output Short Circuit Current (Vout = 0 V)1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V)4.0 V−5.0 V (Vin = 6.0 V)
Output Voltage Noise (f = 100 Hz to 100 kHz)Iout = 30 mA, Cout = 1 mF
Ripple Rejection(f = 120 Hz, 15 mA)(f = 1.0 kHz, 15 mA)
Enable Input Threshold Voltage (TA = −40°C to 85°C)(Voltage Increasing, Output Turns On, Logic High)(Voltage Decreasing, Output Turns Off, Logic Low)Output Voltage Temperature Coefficient
3.Maximum package power dissipation limits must be observed.
T*TAPD+J(max)
RqJA
4.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
SymbolVout
1.4551.7462.4252.7442.943.2344.900
Regline
−−−150150
Vin−Vout
−−−−−−−
DIS
−
IGND
−
Iout(max)
150150
Vn
−
RR
−−
Vth(en)
0.95−−
−−\"100
−0.3−
5550
−−
V
100
−
dB
300300
600600
mVrms
40
90
mA
0.03
1.0
mA690570400360340320240
750620450420400360300
mA
1.01.00.3240240
3.03.00.8−−
mV
1.51.82.52.83.03.35.0
1.5451.8542.5752.8563.063.3665.100
mV/V
Min
Typ
Max
UnitV
RegloadIo(nom.)
mV/mAmA
TC
ppm/°C
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NCP699
TYPICAL CHARACTERISTICS
450VDD, DROPOUT VOLTAGE (mV)Vout, OUTPUT VOLTAGE (V)400350300250200150100500−60−40−2002040Vin = 4.0 VVout = 3.0 VIout = 150 mA60801003.015Vin = 6.0 V3.010Vin = 4.0 V3.0053.0002.995Vout = 3.0 VIout = 1.0 mA−40−200204060801002.990−60TA, AMBIENT TEMPERATURE (°C)TEMPERATURE (°C)Figure 2. Dropout Voltage vs. TemperatureFigure 3. Output Voltage vs. Temperature43Iq, QUIESCENT CURRENT (mA)4241403938373635−60−40−2002040Vin = 4.0 VVout = 3.0 VIout = 0 mA6080100Iq, QUIESCENT CURRENT (mA)60504030201000Vout = 3.0 VIout = 0 mATA = 25°CCin = 1.0 mFCout = 1.0 mF1.02.03.04.05.06.07.0TEMPERATURE (°C)Vin, INPUT VOLTAGE (V)Figure 4. Quiescent Current vs. Temperature60Ignd, GROUND CURRENT (mA)504030201000
Vout = 3.0 VIout = 30 mATA = 25°CCin = 1.0 mFCout = 1.0 mF1.0
2.0
3.0
4.0
5.0
6.0
7.0
7060RIPPLE REJECTION (dB)50403020100100
Figure 5. Quiescent Current vs. Input VoltageVin = 4.0 VCout = 1.0 mFIout = 30 mA1.0k10k
FREQUENCY (Hz)
100k1.0M
Vin, INPUT VOLTAGE (V)
Figure 6. Ground Pin Current vs. Input VoltageFigure 7. Ripple Rejection vs. Frequency
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NCP699
TYPICAL CHARACTERISTICS
7OUTPUT VOLTAGE NOISE (mV/ǰHz)654321010
100
1.0k
10k
100k
1.0M
Vin = 4.0 VCout = 1.0 mFIout = 30 mAFREQUENCY (Hz)
Figure 8. Output Noise Density
Figure 9. Line Transient Response
Figure 10. Load Transient Response
3.5Vout, OUTPUT VOLTAGE (V)3.02.5Iout = 1.0 mA2.0
150 mA1.51.00.500
Figure 11. Turn−on Response
TA = 25°C1.0
2.0
3.0
4.0
5.0
6.0
Vin, INPUT VOLTAGE (V)
Figure 12. Output Voltage vs. Input Voltage
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NCP699
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in outputcurrent at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator outputno longer maintains regulation against further reductions ininput voltage. Measured when the output drops 3.0% belowits nominal. The junction temperature, load current, andminimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The change in output voltage for a change in input voltage.The measurement is made under conditions of lowdissipation or by using pulse technique such that the averagechip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltageis excited with a given slope.
Thermal Protection
The maximum total dissipation for which the regulatorwill operate within its specifications.
Quiescent and Ground Current
The quiescent current is the current which flows throughthe ground when the LDO operates without a load on itsoutput: internal IC operation, bias, etc. When the LDObecomes loaded, this term is called the Ground current. It isactually the difference between the input current (measuredthrough the LDO input pin) and the output current.
Internal thermal shutdown circuitry is provided to protectthe integrated circuit in the event that the maximum junctiontemperature is exceeded. When activated at typically 160°C,the regulator turns off. This feature is provided to preventfailures from accidental overheating.
Maximum Package Power Dissipation
The maximum power package dissipation is the powerdissipation level at which the junction temperature reachesits maximum operating value, i.e. 125°C. Depending on theambient power dissipation and thus the maximum availableoutput current.
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NCP699
APPLICATIONS INFORMATION
A typical application circuit for the NCP699 series isshown in Figure 1, front page.
Input Decoupling (Cin)
Set external components, especially the output capacitor,as close as possible to the circuit, and make leads as short aspossible.
Thermal
A 1.0 mF capacitor either ceramic or tantalum isrecommended and should be connected close to the NCP699package. Higher values and lower ESR will improve theoverall line transient response.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Output Decoupling (Cout)
The NCP699 is a stable regulator and does not require anyspecific Equivalent Series Resistance (ESR) or a minimumoutput current. Capacitors exhibiting ESRs ranging from afew mW up to 5.0 W can thus safely be used. The minimumdecoupling value is 1.0 mF and can be augmented to fulfillstringent load transient requirements. The regulator acceptsceramic chip capacitors as well as tantalum capacitors.Larger values improve noise rejection and load regulationtransient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,or C3216X7R1C105K
Enable Operation
As power across the NCP699 increases, it might becomenecessary to provide some thermal relief. The maximumpower dissipation supported by the device is dependentupon board design and layout. Mounting pad configurationon the PCB, the board material and also the ambienttemperature effect the rate of temperature rise for the part.This is stating that when the NCP699 has good thermalconductivity through the PCB, the junction temperature willbe relatively low with high power dissipation applications.The maximum dissipation the package can handle isgiven by:
T*TAPD+J(max)
RqJA
If junction temperature is not allowed above themaximum 125°C, then the NCP699 can dissipate up to400 mW @ 25°C.
The power dissipated by the NCP699 can be calculatedfrom the following equation:
Ptot+[Vin*Ignd(@Iout)])[Vin*Vout]*Iout
The enable pin will turn on the regulator when pulled highand turn off the regulator when pulled low. These limits ofthreshold are covered in the electrical specification sectionof this data sheet. If the enable is not used then the pin shouldbe connected to Vin.
Hints
or
P)Vout*Iout
VinMAX+tot
Ignd(@Iout))Iout
Please be sure the Vin and Gnd lines are sufficiently wide.When the impedance of these lines is high, there is a chanceto pick up noise or cause the regulator to malfunction.
If an 150 mA output current is needed then the groundcurrent from the data sheet is 40 mA. For an NCP699 (3.0 V),the maximum input voltage will then be 5.65 V.
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NCP699
ORDERING INFORMATION
Device
NCP699SN15T1GNCP699SN18T1GNCP699SN25T1GNCP699SN28T1GNCP699SN30T1GNCP699SN33T1GNCP699SN50T1G
NominalOutput Voltage*
1.51.82.52.83.03.35.0
MarkingLJPLJSLJTLJULJVLJWLJX
TSOP−5(Pb−Free)
3000 Units/7″ Tape & Reel
Package
Shipping†
*Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecification Brochure, BRD8011/D.
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NCP699
PACKAGE DIMENSIONS
TSOP−5
(SOT23−5, SC59−5)
SN SUFFIXCASE 483−02ISSUE F
NOTE 52X
D5X0.20CAB512430.10T0.20TLABSMKDETAIL Z2X
GNOTES:
1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.
2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDESLEAD FINISH THICKNESS. MINIMUM LEADTHICKNESS IS THE MINIMUM THICKNESSOF BASE MATERIAL.
4.DIMENSIONS A AND B DO NOT INCLUDEMOLD FLASH, PROTRUSIONS, OR GATEBURRS.
5.OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWEDIN THIS LOCATION. TRIMMED LEAD NOT TOEXTEND MORE THAN 0.2 FROM BODY.
DIMABCDGHJKLMS
MILLIMETERSMINMAX3.00 BSC1.50 BSC0.901.100.250.500.95 BSC0.010.100.100.260.200.601.251.550 _10 _2.503.00
DETAIL ZC0.05HTSEATINGPLANEJSOLDERING FOOTPRINT*
1.90.0740.950.0372.40.0941.00.0390.70.028mmǓǒinches
SCALE 10:1*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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