COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR

专利名称：COPPER ALLOY FOR ELECTRONIC

EQUIPMENT, METHOD FOR PRODUCINGCOPPER ALLOY FOR ELECTRONICEQUIPMENT, ROLLED COPPER ALLOYMATERIAL FOR ELECTRONIC EQUIPMENT,AND PART FOR ELECTRONIC EQUIPMENT

发明人：Kazunari MAKI,Yuki ITO申请号：US15414194申请日：20170124

公开号：US20170130309A1公开日：20170511

专利附图：

摘要：This copper alloy for electronic devices includes Mg at a content of 3.3 at % ormore and 6.9 at % or less, with a remainder substantially being Cu and unavoidableimpurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (%IACS) is in a range of σ≦{1.7241/(−0.0347×X+0.6569×X+1.7)}×100, and a stress relaxationrate at 150° C. after 1,000 hours is in a range of 50% or less.

申请人：MITSUBISHI MATERIALS CORPORATION

地址：Tokyo JP

国籍：JP

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