Integrated circuit package and method

专利名称：Integrated circuit package and method发明人：Deviprasad Malladi,Mario J. Lee,Ehsan

Ettehadieh,Nagaraj Mitty

申请号：US09/205424申请日：19981204公开号：US05972736A公开日：19991026

摘要：An integrated circuit package with heat slug is disclosed. The heat slug isthermally coupled to one or more semiconductor die using a single layer of highconductivity adhesive. The assembly process of this invention includes the steps ofinitially attaching a temporary heat slug to the back side of a package body, to which oneor more semiconductor die are attached. The semiconductor die are then electricallyconnected to the package body and encapsulated to maintain fixed positions within thepackage cavity. The temporary heat slug is then moved and a final heat slug is attachedto the package body and the back side of the one or more semiconductor dies utilizing asingle layer of high conductivity adhesive. The package is compact, has reducedcomplexity, and is inexpensive to manufacture.

申请人：SUN MICROSYSTEMS, INC.

代理机构：Flehr Hohbach Test Albritton & Herbert

代理人：Steven F. Caserza

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