专利名称:Wire clamp
发明人:越 和也,松林 由紘,居崎 枝理子,中野 貴博申请号:JP2018136910申请日:20180720公开号:JP67571B2公开日:20200214
摘要:Problem to be solved: to provide a wiring clamp capable of suppressing theincrease in the size and cost of the metal mold used in forming the wiring clamp andreducing the cost of the product. Solution Wiring clampA band 30 for winding andholding the bundlesProvided with a buckle portion 20 coupled to the bandBand 30Havinga locking tooth 31 formed in the longitudinal directionBuckle portionPenetratingthrough the insideBand insertion path 22 for inserting band 30 andA lock piece 25 havinga retaining tooth 251 is engaged with the locking teeth 31 of the band 30 inserted intothe band insertion path 22 to keep the band wound around the bandWhen viewed fromthe front of the buckle partAn opening R is formed in the buckle 20 to expose the lockpiece 25 located in the band passage 22.Diagram
申请人:株式会社ニックス
地址:神奈川県横浜市西区みなとみらい2丁目3番3号
国籍:JP
代理人:稲葉 良幸,田中 克郎
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