专利名称：ADHESIVE COMPOSITION FOR TEMPORARY
BONDING OF SEMICONDUCTOR
WORKPIECE AND SUPPORT CARRIER PAIR
发明人：Chunbin Zhang,Xiaotian Zhou,Minghao
Shen,Yijiang Hu,Shaolin Zou
申请号：US16297394申请日：20190308
公开号：US20190276712A1公开日：20190912
专利附图：
摘要：Disclosed is an adhesive composition for temporarily bonding a semiconductor
workpiece and support carrier pair with improved adhesive film properties. The adhesivecomposition may include one or more polymer resins, solvents, and a small but criticalquantity of surfactants, among others. In operation, the one or more surfactants mayimprove film continuity, leveling, and reduce voids and defects. Sample semiconductorworkpiece includes a semiconductor silicon wafer and sample support carrier includesrigid semiconductor silicon or glass, sapphire or other rigid materials.
申请人：Chengdu ESWIN SiP Technology Co., Ltd.,Beijing ESWIN Technology Co., Ltd.
地址：Chengdu City CN,Beijing City CN
国籍：CN,CN
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